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Brian Sims
Editor |
HDI – High Density Interconnect PCBs
13 April 2022
NCAB has a long experience building HDI boards, with a factory base with a deep expertise producing HDI PCBs for different market applications.
These factories, combined with our worldwide technical organization, bring a comprehensive knowledge of the requirements and manufacturing methods required for successful HDI products.
What defines a HDI board?
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). There are different types of HDI features, type I, type II and type III as defined in IPC-2226. In our FAQ you can learn more about the different types.
Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.
| Feature | NCAB´s technical specification |
| Number of layers | 4 – 22 layers standard, 30 layers advanced |
| Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
| HDI builds | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D |
| Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
| Copper weights (finished) | 18μm – 70μm |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 3.20mm |
| Maxmimum dimensions | 610mm x 450mm; dependant upon laser drilling machine |
| Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.15mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
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