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RF – Radio frequency PCBs

13 April 2022

Radio frequency (RF) and microwave (MW) circuits can be found in wireless products from handheld devices for medical and industrial applications to advanced communications systems for base stations, radar and global positioning.

NCAB works close with your product design team to insure that the project’s cost/performance targets can be met by providing information on material options, relative costs and DFM considerations.

When producing radio frequency PCBs it is important to think about how to control the signals using (i) materials types and material characteristics (loss tangent / Df and dielectric constant / Dk) (ii) low profile copper foils (iii) weave styles and (iv) how we layout the copper circuitry, as all of these factories have a significant impact on the the performance of the finished product.

Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.

Feature NCAB´s technical specification
Number of layers 2-20 layers
Technology highlights Controlled impedance, low loss materials, miniaturization
Materials Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled
Dielectric thickness 0.1mm – 3.0mm
Profile method Routing, v-score
Copper weights (finished) ½ to 6 ounce
Minimum track and gaps 0.075mm / 0.075mm
Metal core thickness 0.4-2mm post bonded
Maxmimum dimensions 580mm x 1010mm
Surface finishes available HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver

 
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